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| S amHop Microelectronics C orp. S DS 9906 J UL. 30 2004 v1.1 N-C hannel E nhancement Mode Field E ffect Transistor P R ODUC T S UMMAR Y V DS S 20V F E AT UR E S ( m [ ) Max ID 3.1A R DS (ON) S uper high dense cell design for low R DS (ON). 60 @ V G S = 4V 85 @ V G S =2.5V R ugged and reliable. S OT-23 package. D S OT-23 D S G G S ABS OLUTE MAXIMUM R ATINGS (TA=25 C unless otherwise noted) P arameter Drain-S ource Voltage Gate-S ource Voltage Drain C urrent-C ontinuous a @ TJ=125 C b -P ulsed Drain-S ource Diode Forward C urrent a Maximum P ower Dissipation a Operating Junction and S torage Temperature R ange S ymbol VDS VGS ID IDM IS PD TJ, TS TG Limit 20 8 3.1 12 1.25 1.25 -55 to 150 Unit V V A A A W C THE R MAL C HAR AC TE R IS TIC S Thermal R esistance, Junction-to-Ambient a R thJA 100 C /W 1 S DS 9906 E LE CTR ICAL CHAR ACTE R IS TICS (TA = 25 C unless otherwise noted) Parameter OFF CHAR ACTE R IS TICS Drain-S ource Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage BVDSS IDSS IGSS VGS(th) R DS (ON) gFS CISS COSS CRSS c S ymbol Condition VGS = 0V, ID = 250uA VDS = 16V, VGS = 0V VGS = 8V,VDS = 0V VDS = VGS, ID = 250uA VGS = 4.0V, ID = 2.8A VGS = 2.5V, ID = 2.0A VDS = 7V, ID = 5A Min Typ C Max Unit 20 1 V uA 100 nA 0.6 0.8 44 53 5 608 114 86 1.5 60 85 V m ohm ON CHAR ACTE R IS TICS b Gate Threshold Voltage Drain-S ource On-S tate R esistance Forward Transconductance S PF PF PF DYNAMIC CHAR ACTE R IS TICS c Input Capacitance Output Capacitance R everse Transfer Capacitance VDS =10V, VGS = 0V f =1.0MHZ S WITCHING CHAR ACTE R IS TICS Turn-On Delay Time R ise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-S ource Charge Gate-Drain Charge tD(ON) tr tD(OFF) tf Qg Qgs Qgd VDD = 10V, ID = 1A, VGEN = 4.5V, R L = 10 ohm R GE N = 10 ohm VDS =10V, ID = 1A, VGS =4.5V 10 14 39 26 9.2 1.6 2.6 ns ns ns ns nC nC nC 2 S DS 9906 E LE CTR ICAL CHAR ACTE R IS TICS (TA=25 C unless otherwise noted) Parameter 5 Diode Forward Voltage S ymbol VSD Condition VGS = 0V, Is =1.25A Min Typ Max Unit 0.84 1.3 V C DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS b Notes a.S urface Mounted on FR 4 Board, t 10sec. b.Pulse Test:Pulse Width 300us, Duty Cycle 2%. c.Guaranteed by design, not subject to production testing. 10 V G S =3V 8 20 V G S =10,9,8,7,6,5,4V 25 T j=125 C 25 C ID, Drain C urrent(A) ID, Drain C urrent (A) -55 C 15 6 V G S =2V 4 2 0 10 5 0 0.0 0 1 2 3 4 5 6 0.5 1 1.5 2 2.5 3 V DS , Drain-to-S ource Voltage (V ) V G S , G ate-to-S ource Voltage (V ) F igure 1. Output C haracteris tics R DS (ON), On-R es is tance(Ohms ) 2.2 1.8 1.4 1.0 0.6 0.2 0 F igure 2. Trans fer C haracteris tics V G S =4V ID=3A 1100 C , C apacitance (pF ) 880 660 440 220 0 C rs s 0 5 10 15 20 25 30 C is s C os s -50 -25 0 25 50 75 100 125 T j( C ) V DS , Drain-to S ource Voltage (V ) F igure 3. C apacitance F igure 4. On-R es is tance Variation with Temperature 3 S DS 9906 B V DS S , Normalized Drain-S ource B reakdown V oltage V th, Normalized G ate-S ource T hres hold V oltage 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 V DS =V G S ID=250uA 1.15 ID=250uA 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 T j, J unction T emperature ( C ) T j, J unction T emperature ( C ) F igure 5. G ate T hres hold V ariation with T emperature 18 F igure 6. B reakdown V oltage V ariation with T emperature 20 10 gFS , T rans conductance (S ) 12 9 6 3 0 0 5 10 15 V DS =7V 20 25 Is , S ource-drain current (A) 15 1 0 0.6 0.8 1.0 1.2 T J =25 C 1.4 1.6 IDS , Drain-S ource C urrent (A) V S D, B ody Diode F orward V oltage (V ) F igure 7. T rans conductance V ariation with Drain C urrent 5 ID, Drain C urrent (A) F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent 50 V G S , G ate to S ource V oltage (V ) 4 3 2 1 0 0 VDS =10V ID=1A 10 RD ON S( )L im it 10 1s 10 0m ms s 11 DC 0.1 0.03 VGS =4.5V S ingle P ulse T c=25 C 0.1 1 10 20 50 V DS , Drain-S ource V oltage (V ) 2 4 6 8 10 12 14 16 Qg, T otal G ate C harge (nC ) F igure 9. G ate C harge F igure 10. Maximum S afe O perating Area 4 S DS 9906 V DD ton toff tr 90% 5 VG S R GE N V IN D G RL V OUT td(on) V OUT td(off) 90% 10% tf 10% INVE R TE D 90% S V IN 50% 10% 50% P ULS E WIDTH F igure 11. S witching T es t C ircuit 10 F igure 12. S witching Waveforms Normalized Transient Thermal Resistance 1 0.5 0.2 P DM t1 on 0.1 0.1 0.05 0.02 1. 2. 3. 4. t2 0.01 0.00001 0.01 Single Pulse 0.0001 0.001 0.01 0.1 1 10 R thJ A (t)=r (t) * R thJ A R thJ A=S ee Datas heet T J M-T A = P DM* R thJ A (t) Duty C ycle, D=t1/t2 100 1000 Square Wave Pulse Duration(sec) Normalized Thermal Transient Impedance Curve 5 S DS 9906 A L G F M J B C I H E D (TYP .) 2.70 2.40 1.40 0.35 0 3.10 2.80 1.60 0.50 0.10 0.55 1.30 0.20 1.15 10X 0.106 0.094 0.055 0.014 0 0.122 0.110 0.063 0.020 0.004 F G 0.45 1.90 REF. 1.00 0.10 0.40 0.45 0X 0.022 0.018 0.075 REF. 0.039 0.004 0.016 0.033 0X 0.051 0.008 0.045 10X I J L M 6 S DS 9906 SOT-23 Tape and Reel Data SOT-23 Carrier Tape UNIT:P PACKAGE SOT-23 A0 3.20 O0.10 B0 3.00 O0.10 K0 D0 D1 i1.50 +0.10 E 8.00 +0.30 -0.10 E1 1.75 O0.10 E2 3.50 O0.05 P0 4.00 O0.10 P1 4.00 O0.10 P2 2.00 O0.05 T 0.20 O0.02 i1.00 1.33 O0.10 +0.25 SOT-23 Reel UNIT:P TAPE SIZE 8P REEL SIZE i178 M i178 O1 N i60 O1 W 9.00 O0.5 W1 12.00 O0.5 H i13.5 O0.5 K 10.5 S G R 5.00 V 18.00 2.00 i10.0 O0.5 7 |
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